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LP-200 - Bolígrafo de succión manual para soldar, herramienta de succión para circuitos integrados

<div>Características:
1、Punta del bolígrafo de succión al vacío: Punta del bolígrafo de succión al vacío: Puede soportar un flujo de aire de alta temperatura a 500 ℃ durante 60 segundos, se puede utilizar de forma continua. 2、Fácil de usar: Pequeña y potente bomba de vacío incorporada, sin necesidad de conectar ninguna pajita o cable de alimentación, fácil de usar en cualquier momento. 3、Bolígrafo de vacío antiestático: Operación simple, antiestático, superficie del producto no contaminante, movimiento rápido y ligero. 4、Varios tamaños disponibles: Las puntas de succión al vacío están disponibles en una variedad de tamaños para adaptarse a diferentes tamaños de chips. 5、Aplicación: generalmente se utiliza en SMT y otras industrias para absorber componentes IC.</div>

<ul><li>Specification</li><li>Vacuum suction pen suction electronic parts and small products is particularly convenient, vacuum suction pen is the principle of atmospheric pressure difference to absorb components of a tool, the use of vacuum suction pen pick components compared with the use of tweezers pick components, can greatly avoid bumping the peripheral components.</li><li></li><li>Features:</li><li>1. Vacuum Suction Pen Tip: Vacuum Suction Pen Tip: Can withstand high temperature air flow at 500 ℃ for 60 seconds, can be used continuously.</li><li>2. Easy to Use: Built-in small powerful vacuum pump, no need to connect any straw or power cord, easy to use at any time.</li><li>3. Anti-static Vacuum Pen: Simple operation, anti-static, non-polluting product surface, moving fast and light.</li><li>4. Multiple Sizes Available: Vacuum suction tips are available in a variety of sizes to accommodate different sizes of chips.</li><li>5. Application: generally used in SMT and other industries to absorb IC components.</li><li></li><li>Specification:</li><li>Condition: 100% Brand New</li><li>Item Type: Vacuum Sucker Pen</li><li>Model: LP200</li><li>Color: Shown as Picture</li><li>Vacuum pen is available in straight and curved heads, it comes standard with three sizes of tips:</li><li>LN250: FACE SIZE 1/8" DIA. 3.2mm</li><li>LN260: FACE SIZE 1/4" DIA. 6.4mm</li><li>LN270: FACE SIZE 3/8" DIA. 9.5mm</li><li></li><li>Package List:</li><li>1 * Vacuum Suction Pen</li><li>3 * acuum Suction Pen Tips</li><li></li><li>Note:</li><li>1. Please allow slight error due to manual measurement. Thanks for your understanding.</li><li>2. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.</li><li></li><li>Vacuum Suction Pen Use Method:</li><li>When in use, aim the suction disc of the vacuum suction pen at the middle of the BGA element, then suck the component and remove it. (In between the BGA, the surface of the component should be cleaned well, otherwise it will affect the suction of the vacuum suction pen)</li><li>1. First select the suction cup that corresponds to the size of the IC to be drawn and installed on the suction pen nozzle.</li><li>2. After the suction pen is installed, place the suction cup flat on the IC.</li><li>3. Press the button on the suction pen to remove air from the vacuum device inside the pen, then release the button pen to produce vacuum suction to lift the IC</li><li>4. Place the suction IC in the position to be placed and press the button to remove air from the vacuum device in the pen so that the IC will fall off the suction cup.</li></ul>

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Specification$$Vacuum suction pen suction electronic parts and small products is particularly convenient, vacuum suction pen is the principle of atmospheric pressure difference to absorb components of a tool, the use of vacuum suction pen pick components compared with the use of tweezers pick components, can greatly avoid bumping the peripheral components.$$$$Features:$$1. Vacuum Suction Pen Tip: Vacuum Suction Pen Tip: Can withstand high temperature air flow at 500 ℃ for 60 seconds, can be used continuously.$$2. Easy to Use: Built-in small powerful vacuum pump, no need to connect any straw or power cord, easy to use at any time.$$3. Anti-static Vacuum Pen: Simple operation, anti-static, non-polluting product surface, moving fast and light.$$4. Multiple Sizes Available: Vacuum suction tips are available in a variety of sizes to accommodate different sizes of chips.$$5. Application: generally used in SMT and other industries to absorb IC components.$$$$Specification:$$Condition: 100% Brand New$$Item Type: Vacuum Sucker Pen$$Model: LP200$$Color: Shown as Picture$$Vacuum pen is available in straight and curved heads, it comes standard with three sizes of tips:$$LN250: FACE SIZE 1/8" DIA. 3.2mm$$LN260: FACE SIZE 1/4" DIA. 6.4mm$$LN270: FACE SIZE 3/8" DIA. 9.5mm$$$$Package List:$$1 * Vacuum Suction Pen$$3 * acuum Suction Pen Tips$$$$Note:$$1. Please allow slight error due to manual measurement. Thanks for your understanding.$$2. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.$$$$Vacuum Suction Pen Use Method:$$When in use, aim the suction disc of the vacuum suction pen at the middle of the BGA element, then suck the component and remove it. (In between the BGA, the surface of the component should be cleaned well, otherwise it will affect the suction of the vacuum suction pen)$$1. First select the suction cup that corresponds to the size of the IC to be drawn and installed on the suction pen nozzle.$$2. After the suction pen is installed, place the suction cup flat on the IC.$$3. Press the button on the suction pen to remove air from the vacuum device inside the pen, then release the button pen to produce vacuum suction to lift the IC$$4. Place the suction IC in the position to be placed and press the button to remove air from the vacuum device in the pen so that the IC will fall off the suction cup.

LP-200 - Bolígrafo de succión manual para soldar, herramienta de succión para circuitos integrados

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